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Specifications & Tolerances

The following standard and advanced capabilities will assist printed circuit board (PCB) designers in setting up their basic design checks. Full capabilities for printed circuit board manufacturing may extend beyond the rules below but often times involve additional processes and costs to achieve the desired results. It is recommended that designers who require capabilities beyond what is described below contact us to help maximize the effectiveness of the design and the printed circuit board manufacturing process.

Standard Advanced
Minimum Layer Count 01 01
Maximum Layer Count 16 32
Trace/Space 0.005″ 0.003″
Controlled Impedance +/- 10% +/- 5%
Annular Ring 0.005″ 0.003″ Mechanical, 0.001″ Laser
Outer Layers Finished Copper 1 oz to 2 oz 1 oz to 4 oz
Inner Layers Finished Copper 0.5 oz to 2 oz 0.3 oz to 3 oz
Filled Vias N/A Non-Conductive Fill or Conductive Fill
Smallest Mechanical Drill Diameter 0.006″ 0.004″
Smallest Laser Drill Diameter 0.004″ N/A
Blind Vias No Yes
Buried Vias No Yes
Aspect Ratio 10:01 15:01
Plated Hole to Copper 0.008″ 0.005″
Aspect Ratio 10:01 15:01
Clearance – Copper to Edge of Board Outer Layer – 0.010″ Outer Layer – 0.005″
Inner Layer – 0.015″ Inner Layer – 0.005″
Minimum Panel Size 9″ x 12″ 8″ x 8″
Maximum Panel Size 18″ x 24″ 24″ x 36″
Plated Slots Routed Routed or Nibbled
Non-Plated Slots Routed Routed or Nibbled
Plating in Holes 0.0008″ 0.0015″
Web Soldermask (DAM) 0.004″ 0.004″
Soldermask Clearance 0.003″ 0.001″
Silkscreen Width 0.005″ 0.003″
Standard Advanced
Outer Layers (finished copper) 1 oz. Cu – 6/6 1 oz. Cu – 4/4
2 oz. Cu – 10/10 2 oz. Cu – 8/8
3 oz. Cu – 15/15 3 oz. Cu – 12/12
4 oz. Cu – 20/20 4 oz. Cu – 20/20
Inner Layers 0.5 oz Cu – 5/5 0.5 oz Cu – 3/3
1 oz. Cu – 6/6 1 oz. Cu – 5/5
2 oz. Cu – 10/10 2 oz. Cu – 8/8
***KEY Example : 5/5 = 5 mil trace & 5 mil space
5/5 trace/space
Standard Advanced
Min drilled diameter, final board thickness 0.031″ or lesser 0.006″ 0.004″
Min drilled diameter, final board thickness between 0.031″ and 0.062″ 0.008″ 0.005″
Min drilled diameter, final board thickness between 0.062″ and 0.093″ 0.010″ 0.006″
Min drilled diameter, final board thickness between 0.093″ and 0.125″ 0.015″ 0.008″
Min laser diameter, dielectric thickness less than or equal to 0.004″ 0.004″ 0.003″
Controlled depth blind vias No Yes, max 0.75:1 aspect ratio
Pre-drilled core blind vias No Yes
Sublamination blind vias No Yes
Build-up technology No Upto 4-N-4, Any layer
Buried vias No Yes
Filled vias Non-Conductive filling Non-Conductive or Conductive filling
Nibbling No Yes
Largest hole 0.247″ plated, 0.250″ non-plated Design Specific
Slots Plated or non-plated, routed Plated or non-plated, routed or nibbled
Plating in holes 0.0008″ 0.0015″
Plated hole to copper 0.008″ 0.005″
Standard Advanced
Colors Green, Black, Blue, Red, White, Clear, Yellow Custom Coloring
Finish/Texture Semi-gloss, Matte Semi-gloss, Matte
Tented Vias Yes Yes
Soldermask Plugged Vias Yes Yes
Soldermask Thickness over Copper 0.0007" 1.0 to 1.2 mil (double coat)
Soldermask Web 0.005" (5 mil) 0.003" (3 mil)
Soldermask Gap to Pad 0.004" (4 mil) 0.002" (2 mil)
Copper Ring Under Mask-Defined Pad 0.003" (3 mil) 0.001 (1 mil)
LPI Soldermask Yes Yes
Dry Film Soldermask No Yes
Standard Advanced
Layers 0 - 32 Layers 0 - 32 Layers
Impedance Tolerance Single-ended +/- 10% Single-ended +/- 5%
Impedance Tolerance Differential Pairs +/- 10% Differential Pairs +/- 5%
Time-Domain Reflectometer (TDR) Testing Yes Yes
Standard Advanced
1-Layer Min 0.015″ | Max 0.200″ Min 0.010″ | Max 0.250″
2-Layer Min 0.015″ | Max 0.200″ Min 0.010″ | Max 0.250″
4-Layer Min 0.020″ | Max 0.200″ Min 0.016″ | Max 0.250″
6-Layer Min 0.031″ | Max 0.200″ Min 0.025″ | Max 0.250″
8-Layer Min 0.047″ | Max 0.200″ Min 0.031″ | Max 0.250″
10-Layer Min 0.062″ | Max 0.200″ Min 0.040″ | Max 0.250″
12-Layer Min 0.062″ | Max 0.200″ Min 0.050″ | Max 0.250″
14-Layer Min 0.075″ | Max 0.200″ Min 0.062″ | Max 0.250″
Standard Advanced
Colors Green, Black, Blue, Red, White, Clear, Yellow Custom Colors
Minimum Legend Width 0.004" (4 mil) 0.004" (4 mil)
Spacing between Silkscreen and Pad 0.005" (5 mil) 0.004" (4 mil)