High Density Interconnect (HDI) Boards

We offer High-Density Interconnect (HDI) printed circuit boards with a higher wiring density per unit area than a conventional PCB. They have much finer lines and spaces, smaller vias and capture pads, and higher connection pad density than employed in conventional PCB technology. Our HDI PCBs are made through Microvia, buried vias and sequential lamination with insulation materials and also employ conductor wiring for a higher density of routing.

Our HDI PCB with a reduced footprint, enhance the electrical performance of the application device. HDI PCB is the best alternative to high layer-count and expensive standard laminate or sequentially laminated boards. Our expertise in incorporating blind and buried vias help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Multiple via processes, including via in pad and blind via technology, allow designers more PCB real estate to place components. Decreased PCB component size and pitch allow for more I/O in smaller geometries. This means the faster transmission of signals and a significant reduction in signal loss and crossing delays.

Product Variants

  • Through vias from surface to surface
  • Buried vias and through vias
  • Two or more HDI layer with through vias
  • Passive substrate with no electrical connection
  • Coreless construction using layer pairs
  • Alternate constructions of coreless constructions using layer pairs


  • High level of Reliability
  • With increase of the wiring density, PCB layer count and footprint is reduced
  • Increase in design efficiency, resulting in better signal integrity
  • Enhanced thermal properties
  • Supports the use of advanced packaging technology
  • Minimal radio frequency interference, electromagnetic interference and electrostatic discharge


Property Typical Value Advanced Production
Layer Count 4 - 16 Layers 4 - 20 Layers
PCB Thickness 0.6 - 1.0 mm 0.6 - 3.0 mm
Build up Technology i+N+i (i≥2) HDI PCB Any Layer Microvias Copper filled
Min. Laser Drill Diameter 4 mil 3 mil
Laser Technology CO2 laser Drilling CO2 laser Drilling
Materials FR4 FR4(HF)
Glass Transition(TG) 140°C / 150°C / 170°C 140°C / 150°C / 170°C
Copper Plating Holes 12 µm / 18 µm 12 µm / 18 µm
Inner Layer Registration +/-3 mil +/-2 mil
Min. Line / Spacing 3 / 3 mil 2.5 / 2.5 mil (BGA area)
Min. Annular Ring 2.5 mil 2.5 mil
Smallest Drill 0.20 mm 0.15 mm