High Density Interconnect (HDI) Boards
We offer High-Density Interconnect (HDI) printed circuit boards with a
higher wiring density per unit
area than a conventional PCB. They have much finer lines and spaces, smaller vias and capture pads,
and higher connection pad density than employed in conventional PCB technology. Our HDI PCBs are made
through Microvia, buried vias and sequential lamination with insulation materials and also employ
conductor wiring for a higher density of routing.
Our HDI PCB with a reduced footprint, enhance the electrical performance of the
HDI PCB is the best alternative to high layer-count and expensive standard laminate or sequentially
laminated boards. Our expertise in incorporating blind and buried vias help to save PCB real estate
by allowing features and lines to be designed above or below them without making a connection.
Multiple via processes, including via in pad and blind via technology, allow designers more PCB real
estate to place components. Decreased component size and pitch allow for more I/O in smaller
geometries. This means the faster transmission of signals and a significant reduction in signal loss
and crossing delays.