The choice of the surface finish is an essential step in the design & fabrication of the Printed Circuit Boards. Surface Finishing ensures the connectivity between the PCB and component devices, apart from protecting the exposed copper circuitry from the effects of oxidation before the commencement of assembly process. This also provides a good underpinning of the connection to the electronic device. Through this process, we ensure that the solder joint is reliable & ready for long-term performance.
Standard | Advanced | |
---|---|---|
Hot Air Solder Level (HASL – Lead) | Yes | Yes |
Hot Air Solder Level (HASL – Lead-Free) | Yes | Yes |
Electroless Nickel Immersion Gold (ENIG) | Yes | Yes |
Immersion Silver | Yes | Yes |
Hard Gold Fingers with ENIG | Yes | Yes |
Hard Gold Fingers with HASL | Yes | Yes |
Electrolytic Hard Gold | Yes | Yes |
Electrolytic Soft Gold | Yes | Yes |
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) | No | Yes |
Organic Surface Protectant (OSP) | Yes | Yes |
Bare Copper | Yes | Yes |
Electroless Palladium Immersion Gold (EPIG) | No | Yes |
Tin Nickel | No | Yes |
White Tin | Yes | Yes |
Carbon Ink | No | Yes |