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Range of Surface Finishes

The choice of the surface finish is an essential step in the design & fabrication of the Printed Circuit Boards. Surface Finishing ensures the connectivity between the PCB and component devices, apart from protecting the exposed copper circuitry from the effects of oxidation before the commencement of assembly process. This also provides a good underpinning of the connection to the electronic device. Through this process, we ensure that the solder joint is reliable & ready for long-term performance.

Standard Advanced
Hot Air Solder Level (HASL – Lead) Yes Yes
Hot Air Solder Level (HASL – Lead-Free) Yes Yes
Electroless Nickel Immersion Gold (ENIG) Yes Yes
Immersion Silver Yes Yes
Hard Gold Fingers with ENIG Yes Yes
Hard Gold Fingers with HASL Yes Yes
Electrolytic Hard Gold Yes Yes
Electrolytic Soft Gold Yes Yes
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) No Yes
Organic Surface Protectant (OSP) Yes Yes
Bare Copper Yes Yes
Electroless Palladium Immersion Gold (EPIG) No Yes
Tin Nickel No Yes
White Tin Yes Yes
Carbon Ink No Yes