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PCB Fabrication

PCB fabrication capabilities have advanced over the years, enabling the production of smaller, more complex, and high-performance boards. These advancements include the ability to create boards with higher layer counts, finer trace widths and spacing, controlled impedance for signal integrity, and various surface finishes to meet specific application requirements. PCB fabrication plays a crucial role in the electronics industry, providing the foundation for the development of a wide range of electronic devices, from consumer electronics to aerospace systems. The success of a product often relies on the quality and reliability of the fabricated PCB, making it a vital step in the overall manufacturing process.

HDI

Description Production Advanced
Structure 3+n+3 (9+N+9 MAX) 10+N+10
Layer Count 2~42L 50L
Min. Board thickness 0.005" (+/-10%) 0.005" (+/-10%)s
Max. Board thickness 0.250" (+/-10%) 0.280" (+/-8%)
BGA Pitch 10mils (0.25mm) 7mils (0.175mm)
Min.BGA pad/space 7mils/3mils 5mils/2mils

Materials for build up

Description Production Advanced
Prepreg (FR4 1067/1086/2113) Yes Yes
Prepreg (ceramics Ro4350) Yes Yes
Laser Drillable Prepreg Yes Yes
laser Drillable core (FR4, PI, PTFE, ceramics) Yes Yes
laser Drillable Min.Dielectric thickness 1.5mils 1.5mils
laser Drillable Max.Dielectric thickness 5mils 6mils

Laser via

Description Production Advanced
Min / Max 2.5mils / 6mils 2mils / 6mils
Min via edge to via edge space 6mils 4mils
True position Tolerance +/-1mils +/-1mils

Drilling

Description Production Advanced
Min. Drilled blind via diameter (as drilled) 10mils 8mils
Min via edge to via edge space (as drilled) 8mils 6mils

PTH Design

Description Production Advanced
Blind via aspect ratio (dielectric thickness/ Laser drill hole size) 0.8 1
Blind via plating thickness 0.3~1mils 0.3~1mils
Capture pad A/R 2mils 1.5mils
Laser via Fill Material Epoxy resin/Copper paste Epoxy resin/Copper paste
Blind via aspect ratio (as drilled) (dielectric thickness/ drilling hole size) 0.5 0.5
Blind via plating thickness (as drilled) 0.5mils 0.8mils
Capture pad A/R (as drilled) 4mils 3mils

Rigid - FLEX


Stackup TYPE

Description Production Advanced
Yes Yes
Yes Yes

Board Dimensions

Description Production Advanced
Max. Finish Board Size 16"X20" 18"X26"
min. Finish Board Size 0.2"x0.2" 0.15"*0.15"
Max. Board Thickness 0.250"(+/-10%) 0.280"(+/-8%)
Min. Board Thickness 0.016"(+/-10%) For 4L 0.016"(+/-10%) For 4L

Lamination

Description Production Advanced
Layer Count 4~42L 50L
Layer to Layer Registration +/-4mils +/-3mils

Drilling

Description Production Advanced
Min. Drill Size 6mils 5mils
Min. Hole to Hole Pitch 20mils(0.5mm) 18mils(0.45mm)
True position Tolerance +/-3mils +/-2mils
Slot Diameter Tolerance +/-3mils +/-2mils
Min gap from PTH to track inner layers 6mils 4mils
Min gap from PTH to the border of rigid flex 30mils 20mils
Min. PTH Hole edge to PTH Hole edge space 10mils 8mils

Plating

Description Production Advanced
Max. Aspect Ratio 6:1 8:1
Cu Thickness in Through hole >1mils >1mils
Plated hole size tolerance +/-2mils +/-1.5mils
NPTH hole tolerance +/-2mils +/-1mils
Via in pad Fill Material Epoxy resin/Copper paste Epoxy resin/Copper paste

Layer

Description Production Advanced
Min. Trace/Space 3mils / 3mils 2.5mils / 2.5mil
Min. pad over drill size 6mils 4mils
Max. Copper thickness 1~2 oz 3 oz
Line/ pad to board edge 6mils 4mils
Min gap from Copper to the border of rigid flex 15mils 10mils
Line Tolerance +/-20% +/-10%

Metal Finish

Description Production Advanced
HASL 50-1000u" 50-1000u"
HASL+Selective Hard gold Yes Yes
OSP 8-20u" 8-20u"
Selective ENIG+OSP Yes Yes
ENIG(Nickel/Gold) 80-200u"/2-9 u" 250u"/ 10u"
Immersion Silver 6-18u" 6-18u"
Hard Gold for Tab 10-80u" 10-18u"
Immersion Tin 30u"min 30u"min
ENEPIG (Ni/Pd/Au) 125u"/4u"/1u" min 150u"/8u"/2u" min
Soft Gold (Nickel/ Gold) 200u"/ 20u"min 200u"/ 20u"min

Coverlay

Description Production Advanced
Thickness(Min) (PI / ADH) 0.5mils / 1mils 0.5mils / 1mils
dam width 20mils 15mils
registration tolerance +/-15mils +/-10mils

Solder Mask

Description Production Advanced
S/M Thickness 0.4mils min 3mils max
Solder dam width 4mils 3mils
S/M registration tolerance +/-2.5mils +/-2mils
S/M over line 3.5mils 2mils / 2mils

Legend

Description Production Advanced
Min. Space to SMD pad 6mils 4mils
Min. Stroke Width 6mils 5mils
Min. Space to Copper pad 6mils 4mils
Standard Color White or Yellow NA

Electrical Testing

Description Production Advanced
Max. Test Points 30000 Points 30000 Points
Smallest SMT Pitch 20mils(0.45mm) 16mils(0.3mm)
Smallest BGA Pitch 20mils(0.3mm) 16mils(0.15mm)

laser Rout (LPKF)

Description Production Advanced
Min. Rout to copper space 6mils 4mils
Rout tolerance +/-2mils +/-2mils

NC Rout

Description Production Advanced
Min. Rout to copper space 8mils 4mils
Rout tolerance +/-4mils +/-3mils

Impendance Control

Description Production Advanced
Impedance controll +/-8% +/-5%

EMI

Description Production Advanced
PC-5500&PC-5600 Yes Yes

Stiffener

Description Production Advanced
PI Yes Yes
FR4 Yes Yes
Metal Yes Yes

Conductive & thermal adhesive

Description Production Advanced
3M Type Yes Yes

Eccobond

Description Production Advanced
Eccobond over Flex width 60mils 60mils

Rigid


Inner Layer

Description Production Advanced
Min.Trace/Space 2mils / 2mils 15mils
Min. Copper Thicknesse 1/3oz 1/7oz
Max. Copper Thickness 6oz 10oz
Min. Core Thickness 2mils 1.5mils
Line/ pad to drill hole 6mils 4mils
Line/ pad to board edge 8mils 6mils
Line Tolerance +/-10% +/-8%

Board Dimensions

Description Production Advanced
Max. Finish Board Size 19"X24" 18"X26"
min. Finish Board Size 0.2"x0.2" 0.15"*0.15"
Max. Board Thickness 0.260"(+/-10%) 0.280"(+/-8%)
Min. Board Thickness 0.007"(+/-10%) For 4L 0.005"(+/-10%) For 4L

Lamination

Description Production Advanced
Layer Count 50L 60L
Layer to Layer Registration +/-4mils +/-2mils

Drilling

Description Production Advanced
Min. Drill Size 6mils 5mils
Min. Hole to Hole Pitch 18mils(0.5mm) 14mils(0.45mm)
True position Tolerance +/-3mils +/-2mils
Slot Diameter Tolerance +/-3mils +/-2mils
Min gap from PTH to track inner layers 5mils 4mils
Min gap from PTH to the border of rigid flex 10mils 8mils

Plating

Description Production Advanced
Max. Aspect Ratio 30:1 35:1
Cu Thickness in Through hole 1.5mils 2oz
Plated hole size tolerance +/-2mils +/-1.5mils
NPTH hole tolerance +/-2mils +/-1mils
Via in pad Fill Material Epoxy resin/Copper paste Epoxy resin/Copper paste

Outer Layer

Description Production Advanced
Min. Trace/Space 2.5mils / 2.5mils 2mils / 2mil
Min. pad over drill size 6mils 4mils
Max. Copper thickness 10oz 16oz
Line/ pad to board edge 8mils 6mils
Line Tolerance +/-15% +/-8%

Metal Finish

Description Production Advanced
HASL 50-1000u" 50-1000u"
HASL+Selective Hard gold Yes Yes
OSP 8-20u" 8-20u"
Selective ENIG+OSP Yes Yes
ENIG(Nickel/Gold) 80-200u"/2-9 u" 250u"/ 10u"
Immersion Silver 6-18u" 6-18u"
Hard Gold for Tab 10-80u" 10-18u"
Immersion Tin 30u"min 30u"min
ENEPIG (Ni/Pd/Au) 125u"/4u"/1u" min 150u"/8u"/2u" min
Soft Gold (Nickel/ Gold) 200u"/ 20u"min 200u"/ 20u"min

Solder Mask

Description Production Advanced
S/M Thickness 0.4mils min 2mils max
Solder dam width 4mils 3mils
S/M registration tolerance +/-1.5mils +/-1mils
S/M over line 3.5mils 2mils / 2mils

Legend

Description Production Advanced
Min. Space to SMD pad 6mils 4mils
Min. Stroke Width 6mils 5mils
Min. Space to Copper pad 6mils 4mils
Standard Color White or Yellow NA

Electric Testing

Description Production Advanced
Max. Test Points 30000 Points 30000 Points
Smallest SMT Pitch 18mils(0.45mm) 12mils(0.3mm)
Smallest BGA Pitch 12mils(0.3mm) 6mils(0.15mm)

NC Rout

Description Production Advanced
Min. Rout to copper space 8mils 4mils
Rout tolerance +/-4mils +/-3mils

Scoring (V-cut)

Description Production Advanced
Conductor to center line 15mils 15mils
X&Y Position Tolerance +/-4mils +/-3mils
Score Anger 30o/45o 30o/45o
Score Web 10mils min 8mils min

Beveling

Description Production Advanced
bevel anger 20-71o 20-71o
Bevel Dimensional Tolerance +/-10mils +/-10mils