BIB (BURN IN BOARD)
Our Printed Circuit Board Fabrication abilities include a
wide diversity of Densities, Layer Counts, Materials, Processes and Finishes. We are renowned for
the quick turnarounds – 2 Layer PCB projects as fast as the same day or Multi-Layer PCB projects as
fast as 24 hours.
We are market leaders in the design and manufacture of Burn-in Boards
(BIB). Burn in Board is a printed circuit board that functions as a jig in the Burn-in process. The
Burn-in Board is used as part of the ASIC reliability testing process during which the printed circuit
board components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the
tested ASICs and are designed to withstand high temperatures during tests. Our experts ensure that all
active/passive components and connectors comply with the high-temperature requirements, and all
materials and components meet the high-temperature and the oven ageing requirements.
Starting from material selection to component selection, based on the
test nature, we carefully choose everything to meet the required specifications. We provide boards for
all system types, with solutions available for various test conditions including HTOL, LTOL, PTC, HAST
and 85/85. Each burn-in board is designed by engineers specializing in burn-in board design and can be
tailored to meet the customer’s application requirements and specifications.
We provide quick turnaround time for both Universal board designs and
Custom printed circuit board designs. Skilled in managing all sizes, versatile complexities, BGA, LGA,
QFP, DIP, custom-sockets and multiple layers for both prototype and production quantity.
We do burn-in board manufacturing for various peak temperature ranges from 125
Deg C to 250 Deg C using High Tg FR4 or Special Polyimide materials based on the applicable test