BIB (BURN IN BOARD)
Our Printed Circuit Board
include a wide
diversity of Densities, Layer
Counts, Materials, Processes and Finishes. We are renowned for the quick turnarounds – 2 Layer
projects as fast as the same day or Multi-Layer projects as fast as 24 hours.
We are market leaders in the design and manufacture of Burn-in Boards
Burn in Board is a
printed circuit board that functions as a jig in the Burn-in process. The Burn-in Board is used as
part of the ASIC reliability testing process during which the components are stressed to detect
failures. Burn in Boards consist of sockets to accommodate the tested ASICs and are designed to
withstand high temperatures during tests. Our experts ensure that all active/passive components
and connectors comply with the high-temperature requirements, and all materials and components
meet the high-temperature and the oven ageing requirements.
Starting from material selection to component selection, based on the
nature, we carefully
choose everything to meet the required specifications. We provide boards for all system types,
with solutions available for various test conditions including HTOL, LTOL, PTC, HAST and 85/85.
Each burn-in board is designed by engineers specializing in burn-in board design and can be
tailored to meet the customer’s application requirements and specifications.
We provide quick turnaround time for both Universal board designs and
designs. Skilled in
managing all sizes, versatile complexities, BGA, LGA, QFP, DIP, custom-sockets and multiple layers
for both prototype and production quantity.
We do burn-in board manufacturing for various peak temperature ranges from 125
Deg C to 250 Deg C
using High Tg FR4 or Special Polyimide materials based on the applicable test temperatures.