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Design Limits

The production of Printed Circuit Boards is carried out according to the relevant IPC guidelines and standards and also according to customer defined specifications & requirements. Additionally we have the capability to produce boards of various types with tighter tolerances & also any other speciality requirements. Discuss with us for your requirements.

Descriptional Images Specification Standard Design Intermediate Design Significant Design
cart-image Minimum Trace Width 0.005" 0.003" 0.002"
cart-image Outer Layer Via Pad Size Class 3: 2 Mil, and capable up to landless via 0.005" 0.003"
cart-image Line to Line Spacing 0.005" / 0.005" 0.003" / 0.003" 0.002" / 0.002"
cart-image Minimum Through Hole Drilled 0.008" 0.006" 0.004"
cart-image Minimum Buried Via Drilled 0.008" 0.006" 0.004"
cart-image Minimum Blind Via Drilled 0.008" 0.006" 0.004"
cart-image Blind Via Aspect Ratio 8:1 Aspect Ratio 1:1 1:1
cart-image Maximum PCB Thickness 300 mil 0.008-0.125" 0.002"-0.4"
cart-image Number of Layers 12 Layers 22 layers 40 layers
cart-image Controlled Impedance Tolerance +- 5% or Under Tolerance -0.05 -0.025
cart-image Maximum Board Size 19.5" X 22.5" 20.5 X 24.5" 20.5 X 26"
cart-image Copper Thickness/Density Able to meet customer requirements .25-2 oz 5 microns-20 oz
cart-image Minimum Drill-to-Conductor 6 Mil (edge of hole to track) 0.005" 0.003"
cart-image PCB Edge to Conductor 0.010" 0.005" 0.002"
cart-image Warp (Bow and Twist) Exceeds IPC-TM-650 exceeds IPC Spec exceeds IPC Spec
cart-image Solder Mask DAM 0.010" 0.005" 0.002"