Board Production – Step-by-Step Process

The Printed Circuit Board manufacturing involves multiple stages to achieve a end product. The process is more often an integrated process since each stage of the assembly and production must be compatible with the next, and there must be feedback from the output to the input to ensure that the highest quality is maintained & produced.

01

• Pre-Production

02

• Photo tools Preparation

03

• Inner Layers Printing

04

• Etching of Inner Layers

05

• Inner Layer AOI

06

• Lamination Process

07

• Drilling Process

08

• Copper Deposition

09

• Image Transfer

10

• Plating Process

11

• Etching Process

12

• Outer Layer AOI

13

• Solder mask Process

14

• Surface Finishing

15

• Profiling Steps

16

• Electrical Testing

17

• Final Inspection

18

• Final Packaging